Specifications
Number of board layers: 8 layers
Finished plate thickness: 1.2MM
Finished copper thickness: 1/1OZ
Surface technology: immersion gold 1U"
Solder mask color: Photosensitive black oil
Characteristic impedance: 50/90/100 Ohm
Minimum BGA: 0.3MM
Minimum line width/distance: 3.5Mil/3.5Mil
