Number of layers:6 layers of boards
Finished board thickness:1.2MM
Finished Copper Thickness:1/10Z
Surface Technology: Immersion Gold 1U”
Soldermask Color:Photopolymerized Green Oil
Characteristic Resistance:Differential 90 OHM
Minimum BGA:0.3MM
Minimum Line Width/Pitch:4MIL/4MIL
Minimum Hole Diameter:0.2MM
