Layer:Double/Multilayer Board
Product Category:Flexible circuit boards
Base material: polyimide, polyester, PET, PT, calendering, electrolytic
Finished board thickness:0.068-0.6MM
Copper thickness:1/1OZ
Surface technology: immersion gold, anti-oxidation (OSP)
Soldermask Color:Laminated Covering Film, Liquid Photoimageable Solder Resist Ink, PI Oil Film
Minimum BGA:0.3MM
Minimum line width/spacing:2MIL/2MIL
Minimum Hole Diameter:0.2MM
