Product Features
Excellent thermal conductivity, wide temperature range (-60~+200°C)
Low thermal expansion coefficient and low hardness
No shrinkage and no heat release during curing
Moisture-proof, non-swelling
Good electrical insulation
Can replace the same product of LORD
Product Usage
This product is mainly used for thermal conductive potting protection of various power supplies and switching power supplies, automotive inverter modules, and 5G communication module products.
Its excellent temperature resistance is widely used in the potting and waterproof protection of heater modules and lightning protection modules.
Packaging specification: 30Kg/set, (A glue 15KG/barrel, B glue 15KG/barrel) After opening the lid of the packaging barrel A and B, they should be sealed and stored in time
Note: The above performance data are all tested after curing for 7 days at 25℃ and 55% relative humidity. Our company does not assume any responsibility for the difference in data caused by different test conditions or product improvements.
